Heat Sink Compound

Heat sink compound, also known as thermal paste or thermal grease, is a crucial material used to improve heat transfer between electronic components and heat sinks. It fills microscopic gaps and air pockets that naturally occur between surfaces, allowing better thermal conductivity and preventing overheating. This compound is commonly applied in CPUs, GPUs, power transistors, and LED lighting to ensure efficient heat dissipation. Using a high-quality heat sink compound helps maintain optimal operating temperatures, enhancing the performance and lifespan of electronic devices. Heat sink compound is easy to apply and comes in various formulations, including silicone-based, ceramic-based, and metal-based options, catering to different thermal management needs. Proper application ensures reduced thermal resistance and stable device operation.