The quality of Ansol solder sticks / bar is the best as compared to the other solder brands. Ansol solder bar is made with the extrusion and vacuum processwhich conforms to a uniform alloy composition resulting in consistent and reliable quality. This process eliminates the contamination of metallic oxides and virtually drives out all sulphides,nonmetallic inclusion and other possible contaminations.
In other solder bars the oxides can build up on the surfaces of molten solder to a brownish black mass which is called dross. But becauseof the special metal treatment done during manufacturing process, the surface of ANSOL solder alloy remains glossy in appearance for a longer time which results in less dross formation during wave soldering at the customer end.
ANSOL manufactures many compositions of Lead Free Solder Sticks which are listed below with their properties and recommended application.
COMPOSITION | MELTING POINT °C | TENSILE STRENGTH Mpa/min | RECOMMENDED APPLICATION |
Sn95.5/Ag4.0/Cu0.5 | 217-218 | 37 | Used in electronic , electrical and components |
Sn96.5/Ag3.0/Cu0.5 | 217-219 | 37 | Eutectic alloy. Suitable forall types of pcbs. Excellent soldering results in wave soldering and good SMT process |
Sn99/Ag0.3/Cu0.7 | 225-227 | 25 | Most common solder alloy suitable for soldering of multilayer , PTH and single sided pcbs. Used in wave, dip and HAL soldering applications |
Sn99.7/Ag0.3 | 225 | Replenishment alloy of Sn99/Ag0.3/Cu0.7 to stabilize copper in solder bath | |
Sn99.2/Cu0.6/Ag0.1 | 217-228 | 32 | Low silver contents . |
Sn99.3/Cu0.7 | 227 | 28 | General purpose lead free alloy for soldering of electrical / electronics components and pcbs |
Sn99.0/Cu1.0 | 227 | 32 | Best suitable for electricals and metal components |
Sn95/Sb5 | 236-243 | 35.2 | Special alloy for automobile industry |
Sn80/Zn20 | 200 | For aluminium soldering applications |
Lead Free Solder Stick/bar- Sn99.3Cu0.7
Brand | Ansol | |||||||
Melting Point | 227-260℃ | |||||||
Application | Used in electronic and electrical components General purpose lead free alloy for soldering of electrical / electronics components and pcbs | |||||||
Chemical Composition | ||||||||
Ave | Sn / 99.1 | Pb / 0.247 | Sb / 0.007 | Cu / 0.723 | Ag / 0.0005 | Cd / 0.0078 | In / 0.0030 | Zn / 0.0012 |
Ave | Bi / 0.0048 < | As / 0.0040 | AI / 0.0006 | Fe / 0.0565 | Ni / 0.0016 | Co / 0.0011 | Au / 0.0017 | Ga / 0.0003 |
Ave < | Hg / 0.0020 | Se / 0.0004 |